Substrate : polycrystalline silicon
Size: 1.5-150 mm
Thickness: 1-50 mm/custom
● Surface specification
Surface: Fine grinding/Acid
Irregularity: 2 fringes
Cylindrical Surface: Fine Grinding/ Felt Polish
Parallelism : <3 arc minutes" />
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Silicon Sputtering Target

Update time:2017-06-05 15:20:42The number of clicks: 3501
● General Specification
Substrate : polycrystalline silicon
Size: 1.5-150 mm
Thickness: 1-50 mm/custom
● Surface specification
Surface: Fine grinding/Acid
Irregularity: 2 fringes
Cylindrical Surface: Fine Grinding/ Felt Polish
Parallelism : <3 arc minutes
Related introduction

Material

Polycrystalline Silicon

Size

1.5-150mm/Custom

Thickness

0.2-50mm/Custom

Thickness Tolerance

±0.05mm/Custom

Surface

Fine Grinding/Acid


PROPERTIES

Material

Polycrystalline Silicon

Density

2.329 g/cm3

Refractive Index

[email protected]

Melting point

1420

Surface

Fine Grinding

Cylindrical Surface

Fine Grinding/ Felt Polish

Chamfer/Bevel

0.2-0.3mm

Parallelism

< 3 arc minutes

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